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XCKU035-1FBVA676C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Mount Surface Mount
Contact Plating Copper, Silver, Tin
Package / Case 676-BBGA, FCBGA
Number of Pins 676Pins
Number of I/Os 312I/Os
Published 2012
Series Kintex® UltraScale™
Packaging Tray
Operating Temperature 0°C~85°C TJ
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 676Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Voltage - Supply 0.922V~0.979V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.95V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Number of Outputs 312Outputs
Qualification Status Not Qualified
Operating Supply Voltage 950mV
Power Supplies 0.95V
RAM Size 2.4MB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 444343Logic Elements/Cells
Total RAM Bits 19456000
Number of LABs/CLBs 25391LABs/CLBs
Speed Grade 1
Number of Registers 406256Registers
Length 27mm
Width 27mm
RoHS Status ROHS3 Compliant
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XCKU035-1FBVA676C Documents

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