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XCV1000-4BG560C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 560-LBGA Exposed Pad, Metal
Number of I/Os 404I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Virtex®
Published 2000
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 560Terminations
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1.27mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV1000
Pin Count 560
JESD-30 Code S-PBGA-B560
Number of Outputs 404Outputs
Operating Supply Voltage 2.5V
RAM Size 16kB
Clock Frequency 250MHz
Number of Inputs 404Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 27648Logic Elements/Cells
Total RAM Bits 131072
Number of Gates 1124022Gates
Number of LABs/CLBs 6144LABs/CLBs
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.8 ns
Height Seated (Max) 1.7mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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XCV1000-4BG560C Documents

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