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XCV600-4FG676C Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Xilinx
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 676-BBGA, FCBGA
Number of Pins 676Pins
Number of I/Os 444I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series Virtex®
Published 2000
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 676Terminations
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn63Pb37)
Voltage - Supply 2.375V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 2.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number XCV600
Pin Count 676
Number of Outputs 444Outputs
Operating Supply Voltage 2.5V
RAM Size 12kB
Clock Frequency 250MHz
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 15552Logic Elements/Cells
Total RAM Bits 98304
Number of Gates 661111Gates
Number of LABs/CLBs 3456LABs/CLBs
Speed Grade 4
Combinatorial Delay of a CLB-Max 0.8 ns
Length 27mm
Height Seated (Max) 2.6mm
Width 27mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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XCV600-4FG676C Documents

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