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XCZU3EG-3SFVC784E Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Package / Case 784-BFBGA, FCBGA
Surface Mount YES
Number of I/Os 252I/Os
Operating Temperature 0°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC EG
Published 2016
Part Status Obsolete
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Number of Terminations 784Terminations
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 0.9V
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-PBGA-B784
Speed 600MHz, 667MHz, 1.5GHz
RAM Size 256KB
uPs/uCs/Peripheral ICs Type MICROPROCESSOR CIRCUIT
Core Processor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 154K+ Logic Cells
RoHS Status Non-RoHS Compliant
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XCZU3EG-3SFVC784E Documents

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