Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

XCZU7CG-1FBVB900I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Xilinx
Factory Lead Time 11 Weeks
Package / Case 900-BBGA, FCBGA
Number of I/Os 204I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Zynq® UltraScale+™ MPSoC CG
Published 2016
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
HTS Code 8542.31.00.01
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Speed 500MHz, 1.2GHz
RAM Size 256KB
Core Processor Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Architecture MCU, FPGA
Primary Attributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
RoHS Status ROHS3 Compliant
Select at least one checkbox above to show similar products in this category.
View Similar

XCZU7CG-1FBVB900I Documents

Download datasheets and manufacturer documentation for   XCZU7CG-1FBVB900I

XCZU7CG-1FBVB900I brand manufacturers: Xilinx Inc., Elecinsight stock, XCZU7CG-1FBVB900I reference price.Xilinx Inc.. XCZU7CG-1FBVB900I parameters, XCZU7CG-1FBVB900I Datasheet PDF and pin diagram description download.You can use the XCZU7CG-1FBVB900I Embedded - System On Chip (SoC), DSP Datesheet PDF, find XCZU7CG-1FBVB900I pin diagram and circuit diagram and usage method of function,XCZU7CG-1FBVB900I electronics tutorials.You can download from the Elecinsight.