XKSIM-008 Tech Specifications

Category Memory Cards
Manufacturer XKB Connectivity
Weight 1.3
Overall Dimension W24.6XD17.6XH1.8
Height from mounting surface (mm) 1.8
Soldering Temp (Max) 260°C
Name #REF!
Contact Materials Copper alloys
Conntact Coatings Gold plated
Package Specifications SMD
Maximum Self Height 1.8mm
Connecting Mode Flip-lid type
Part Status Active
Pin Count 6
Card Type NanoSIM卡
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