Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page2

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Integrated Circuits (ICs)
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Embedded - System On Chip (SoC)

							Factory Lead Time	Contact Plating	Mount	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	L1 Cache Data Memory	L1 Cache Instruction Memory	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Minimum Operating Temperature	Moisture Sensitive	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	RoHS	Shipping Restrictions	Tradename	Unit Weight	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Operating Supply Current	Speed	RAM Size	uPs/uCs/Peripheral ICs Type	Core Processor	Peripherals	Clock Frequency	Program Memory Size	Propagation Delay	Connectivity	Architecture	Data Bus Width	Core Architecture	Number of Gates	Max Frequency	Boundary Scan	Speed Grade	RAM (words)	Primary Attributes	Number of Registers	Number of Cores	Bus Compatibility	UV Erasable	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status

					Factory Lead Time	Contact Plating	Mount	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Core	Data RAM Size	Factory Pack QuantityFactory Pack Quantity	L1 Cache Data Memory	L1 Cache Instruction Memory	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Minimum Operating Temperature	Moisture Sensitive	Mounting Styles	Number of I/Os	Number of Logic Array Blocks - LABs	Number of Logic Elements	RoHS	Shipping Restrictions	Tradename	Unit Weight	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Operating Supply Current	Speed	RAM Size	uPs/uCs/Peripheral ICs Type	Core Processor	Peripherals	Clock Frequency	Program Memory Size	Propagation Delay	Connectivity	Architecture	Data Bus Width	Core Architecture	Number of Gates	Max Frequency	Boundary Scan	Speed Grade	RAM (words)	Primary Attributes	Number of Registers	Number of Cores	Bus Compatibility	UV Erasable	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status
	Mfr. XC7Z010-2CLG400I Elecinsight 903-492-XC7Z010-2CLG400I IN STOCK: 1680	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX-7 400BGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	400-LFBGA, CSPBGA	YES	400	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1	-	Active	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	766MHz	30	XC7Z010	-	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-2	256000	Artix™-7 FPGA, 28K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	1.6mm	17mm	-	No	ROHS3 Compliant
XC7Z010-2CLG400I 903-492-XC7Z010-2CLG400I Xilinx Inc. : : - : 1680 1 : -
	Mfr. XC7Z030-1FBG676C Elecinsight 903-492-XC7Z030-1FBG676C IN STOCK: 581	Xilinx Inc.	IC SOC CORTEX-A9 667MHZ 676FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	676-BBGA, FCBGA	YES	676	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	0°C~85°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	-	-	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	667MHz	30	XC7Z030	-	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	2.54mm	27mm	-	No	ROHS3 Compliant
XC7Z030-1FBG676C 903-492-XC7Z030-1FBG676C Xilinx Inc. : : - : 581 1 : -
	Mfr. XC7Z020-2CLG400I Elecinsight 903-492-XC7Z020-2CLG400I IN STOCK: 500	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX-7 400BGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	400-LFBGA, CSPBGA	YES	400	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	766MHz	30	XC7Z020	-	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-2	256000	Artix™-7 FPGA, 85K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	1.6mm	17mm	-	No	ROHS3 Compliant
XC7Z020-2CLG400I 903-492-XC7Z020-2CLG400I Xilinx Inc. : : - : 500 1 : -
	Mfr. XC7Z035-2FFG676I Elecinsight 903-492-XC7Z035-2FFG676I IN STOCK: 881	Xilinx Inc.	IC SOC CORTEX-A9 800MHZ 676FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	Surface Mount	676-BBGA, FCBGA	-	-	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1	-	Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	-	BOTTOM	BALL	NOT SPECIFIED	1V	1mm	800MHz	NOT SPECIFIED	-	S-PBGA-B676	-	-	-	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	ARM	-	-	YES	2	-	Kintex™-7 FPGA, 275K Logic Cells	343800	-	-	-	3.37mm	-	-	-	ROHS3 Compliant
XC7Z035-2FFG676I 903-492-XC7Z035-2FFG676I Xilinx Inc. : : - : 881 1 : -
	Mfr. XC7Z045-2FFG676I Elecinsight 903-492-XC7Z045-2FFG676I IN STOCK: 2858	Xilinx Inc.	IC SOC CORTEX-A9 800MHZ 676FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	676-BBGA, FCBGA	YES	-	-	-	-	-	-	-	-	-	ROMless	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z045	S-PBGA-B676	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-2	256000	Kintex™-7 FPGA, 350K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	3.37mm	27mm	-	No	ROHS3 Compliant
XC7Z045-2FFG676I 903-492-XC7Z045-2FFG676I Xilinx Inc. : : - : 2858 1 : -
	Mfr. XC7Z035-2FFG900I Elecinsight 903-492-XC7Z035-2FFG900I IN STOCK: 2917	Xilinx Inc.	IC SOC CORTEX-A9 800MHZ 900FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	Surface Mount	900-BBGA, FCBGA	-	-	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1	-	Active	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY	-	BOTTOM	BALL	245	1V	1mm	800MHz	30	-	S-PBGA-B900	-	-	-	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	100 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	ARM	-	-	YES	2	-	Kintex™-7 FPGA, 275K Logic Cells	343800	-	-	-	3.35mm	31mm	31mm	-	ROHS3 Compliant
XC7Z035-2FFG900I 903-492-XC7Z035-2FFG900I Xilinx Inc. : : - : 2917 1 : -
	Mfr. XC7Z045-3FFG900E Elecinsight 903-492-XC7Z045-3FFG900E IN STOCK: 681	Xilinx Inc.	IC SOC CORTEX-A9 KINTEX7 900FBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	900-BBGA, FCBGA	YES	-	-	-	-	-	-	-	-	-	ROMless	-	-	-	130	-	-	-	-	-	-	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	-	-	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	1GHz	30	XC7Z045	S-PBGA-B900	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-3	256000	Kintex™-7 FPGA, 350K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	3.35mm	31mm	-	No	ROHS3 Compliant
XC7Z045-3FFG900E 903-492-XC7Z045-3FFG900E Xilinx Inc. : : - : 681 1 : -
	Mfr. XC7Z015-2CLG485I Elecinsight 903-492-XC7Z015-2CLG485I IN STOCK: 3000	Xilinx Inc.	IC SOC CORTEX-A9 766MHZ 485CSBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	Surface Mount	484-LFBGA, CSPBGA	-	485	485-CSBGA (19x19)	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2010	Zynq®-7000	-	-	Active	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	766MHz	-	-	-	-	-	-	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	766MHz	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	766MHz	-	-	-	Artix™-7 FPGA, 74K Logic Cells	-	-	-	-	-	-	-	-	ROHS3 Compliant
XC7Z015-2CLG485I 903-492-XC7Z015-2CLG485I Xilinx Inc. : : - : 3000 1 : -
	Mfr. A2F500M3G-FGG484 Elecinsight 69-492-A2F500M3G-FGG484	Atmel (Microchip Technology)	SoC FPGA A2F500M3G-FGG484	Min.:1 Mult.:1	-	-	-	FPBGA-484	-	-	-	ARM Cortex M3	64 kB	60	-	-	80 MHz	+ 85 C	-	0 C	Yes	SMD/SMT	204 I/O	-	6000 LE	Details	This product may require additional documentation to export from the United States.	SmartFusion	-	-	Tray	-	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	-	-	-	-	16.5 mA	-	-	-	-	-	-	512 kB	-	-	-	-	-	500000	-	-	-	-	-	-	1 Core	-	-	-	-	-	-	-
A2F500M3G-FGG484 69-492-A2F500M3G-FGG484 Atmel (Microchip Technology) : : - : - 1 : -
	Mfr. XC7Z030-1FBG484I Elecinsight 903-492-XC7Z030-1FBG484I IN STOCK: 2047	Xilinx Inc.	IC SOC CORTEX-A9 667MHZ 484FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	484-BBGA, FCBGA	YES	484	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	4 (72 Hours)	484	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	250	1V	1mm	667MHz	30	XC7Z030	-	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	2.54mm	23mm	-	No	ROHS3 Compliant
XC7Z030-1FBG484I 903-492-XC7Z030-1FBG484I Xilinx Inc. : : - : 2047 1 : -
	Mfr. XC7Z010-2CLG400E Elecinsight 903-492-XC7Z010-2CLG400E IN STOCK: 450	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX-7 400BGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	400-LFBGA, CSPBGA	YES	400	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	0°C~100°C TJ	Tray	2010	Zynq®-7000	e1	-	Active	3 (168 Hours)	400	EAR99	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	766MHz	-	XC7Z010	-	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-2	256000	Artix™-7 FPGA, 28K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	1.6mm	17mm	-	No	ROHS3 Compliant
XC7Z010-2CLG400E 903-492-XC7Z010-2CLG400E Xilinx Inc. : : - : 450 1 : -
	Mfr. A2F500M3G-FGG484I Elecinsight 69-492-A2F500M3G-FGG484I	Atmel (Microchip Technology)	SoC FPGA A2F500M3G-FGG484I	Min.:1 Mult.:1	-	-	-	FPBGA-484	-	-	-	ARM Cortex M3	64 kB	60	-	-	80 MHz	+ 100 C	-	- 40 C	Yes	SMD/SMT	204 I/O	-	6000 LE	Details	-	SmartFusion	0.062696 oz	-	Tray	-	A2F500	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	-	-	-	-	16.5 mA	-	-	-	-	-	-	512 kB	-	-	-	-	-	500000	-	-	-	-	-	-	1 Core	-	-	-	-	-	-	-
A2F500M3G-FGG484I 69-492-A2F500M3G-FGG484I Atmel (Microchip Technology) : : - : - 1 : -
	Mfr. XC7Z010-1CLG225C Elecinsight 903-492-XC7Z010-1CLG225C IN STOCK: 990	Xilinx Inc.	IC SOC CORTEX-A9 ARTIX-7 225BGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	225-LFBGA, CSPBGA	YES	225	-	-	-	-	-	-	-	-	-	-	-	-	86	-	-	-	-	-	-	0°C~85°C TJ	Tray	2010	Zynq®-7000	e1	-	Active	3 (168 Hours)	225	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	-	-	8542.39.00.01	BOTTOM	BALL	260	1V	0.8mm	667MHz	30	XC7Z010	-	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-1	256000	Artix™-7 FPGA, 28K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	1.5mm	13mm	-	No	ROHS3 Compliant
XC7Z010-1CLG225C 903-492-XC7Z010-1CLG225C Xilinx Inc. : : - : 990 1 : -
	Mfr. XC7Z035-1FFG676I Elecinsight 903-492-XC7Z035-1FFG676I IN STOCK: 1260	Xilinx Inc.	IC SOC CORTEX-A9 667MHZ 676FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	Surface Mount	676-BBGA, FCBGA	-	-	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	-40°C~100°C TJ	Tray	2010	Zynq®-7000	e1	-	Active	4 (72 Hours)	676	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	-	BOTTOM	BALL	NOT SPECIFIED	1V	-	667MHz	NOT SPECIFIED	-	S-PBGA-B676	-	-	-	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	1.05V	950mV	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	120 ps	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	ARM	-	-	YES	1	256000	Kintex™-7 FPGA, 275K Logic Cells	343800	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	3.37mm	27mm	27mm	-	ROHS3 Compliant
XC7Z035-1FFG676I 903-492-XC7Z035-1FFG676I Xilinx Inc. : : - : 1260 1 : -
	Mfr. XC7Z045-2FFG676E Elecinsight 903-492-XC7Z045-2FFG676E IN STOCK: 571	Xilinx Inc.	IC SOC CORTEX-A9 800MHZ 676FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	676-BBGA, FCBGA	YES	-	-	-	-	-	-	-	-	-	ROMless	-	-	-	130	-	-	-	-	-	-	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	4 (72 Hours)	676	3A991.D	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z045	S-PBGA-B676	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-2	256000	Kintex™-7 FPGA, 350K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	3.37mm	27mm	-	No	ROHS3 Compliant
XC7Z045-2FFG676E 903-492-XC7Z045-2FFG676E Xilinx Inc. : : - : 571 1 : -
	Mfr. A2F200M3F-FGG256I Elecinsight 69-492-A2F200M3F-FGG256I	Atmel (Microchip Technology)	SoC FPGA A2F200M3F-FGG256I	Min.:1 Mult.:1	-	-	-	FPBGA-256	-	-	-	ARM Cortex M3	64 kB	90	-	-	80 MHz	+ 100 C	-	- 40 C	Yes	SMD/SMT	117 I/O	-	2000 LE	Details	-	SmartFusion	0.690329 oz	-	Tray	-	A2F200	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	1.5 V	-	-	-	-	-	-	7 mA	-	-	-	-	-	-	256 kB	-	-	-	-	-	200000	-	-	-	-	-	-	1 Core	-	-	-	-	-	-	-
A2F200M3F-FGG256I 69-492-A2F200M3F-FGG256I Atmel (Microchip Technology) : : - : - 1 : -
	Mfr. XC7Z007S-2CLG400E Elecinsight 903-492-XC7Z007S-2CLG400E IN STOCK: 1337	Xilinx Inc.	IC SOC CORTEX-A9 766MHZ 400BGA	Min.:1 Mult.:1	10 Weeks	-	-	400-LFBGA, CSPBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	100	-	-	-	-	-	-	0°C~100°C TJ	Tray	2016	Zynq®-7000	e3	yes	Active	3 (168 Hours)	400	-	Matte Tin (Sn)	-	-	-	8542.31.00.01	BOTTOM	BALL	NOT SPECIFIED	1V	0.8mm	-	NOT SPECIFIED	-	S-PBGA-B400	-	-	1.05V	-	0.95V	-	-	-	-	766MHz	256KB	-	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	800MHz	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	-	-	-	YES	-	256000	Artix™-7 FPGA, 23K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	1.6mm	17mm	17mm	-	ROHS3 Compliant
XC7Z007S-2CLG400E 903-492-XC7Z007S-2CLG400E Xilinx Inc. : : - : 1337 1 : -
	Mfr. XC7Z045-2FFG900E Elecinsight 903-492-XC7Z045-2FFG900E IN STOCK: 912	Xilinx Inc.	IC SOC CORTEX-A9 800MHZ 900FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	900-BBGA, FCBGA	YES	-	-	-	-	-	-	-	-	-	ROMless	-	-	-	130	-	-	-	-	-	-	0°C~100°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	4 (72 Hours)	900	3A991.D	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	-	-	8542.39.00.01	BOTTOM	BALL	245	1V	1mm	800MHz	30	XC7Z045	S-PBGA-B900	-	1V	1.05V	-	-	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	-	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-2	256000	Kintex™-7 FPGA, 350K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	-	3.35mm	31mm	-	No	ROHS3 Compliant
XC7Z045-2FFG900E 903-492-XC7Z045-2FFG900E Xilinx Inc. : : - : 912 1 : -
	Mfr. XC7Z030-1SBG485C Elecinsight 903-492-XC7Z030-1SBG485C IN STOCK: 2424	Xilinx Inc.	IC SOC CORTEX-A9 667MHZ 485FCBGA	Min.:1 Mult.:1	10 Weeks	Copper, Silver, Tin	-	484-FBGA, FCBGA	YES	485	-	-	-	-	-	-	-	-	-	-	-	-	130	-	-	-	-	-	-	0°C~85°C TJ	Tray	2009	Zynq®-7000	e1	-	Active	4 (72 Hours)	485	EAR99	Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1V	0.8mm	667MHz	NOT SPECIFIED	-	-	Not Qualified	-	1.05V	11.8V	0.95V	CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB	-	-	-	-	256KB	MICROPROCESSOR CIRCUIT	Dual ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	-	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	32b	ARM	-	-	YES	-1	256000	Kintex™-7 FPGA, 125K Logic Cells	-	-	CAN; ETHERNET; I2C; SPI; UART; USB	N	2.44mm	19mm	-	-	ROHS3 Compliant
XC7Z030-1SBG485C 903-492-XC7Z030-1SBG485C Xilinx Inc. : : - : 2424 1 : -
	Mfr. XC7Z007S-1CLG225C Elecinsight 903-492-XC7Z007S-1CLG225C IN STOCK: 1500	Xilinx Inc.	IC SOC CORTEX-A9 667MHZ 225BGA	Min.:1 Mult.:1	10 Weeks	-	-	225-LFBGA, CSPBGA	YES	-	-	-	-	-	-	-	-	-	-	-	-	-	54	-	-	-	-	-	-	0°C~85°C TJ	Tray	2016	Zynq®-7000	e1	yes	Active	3 (168 Hours)	225	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	-	BOTTOM	BALL	260	1V	0.8mm	-	30	-	S-PBGA-B225	-	-	1.05V	-	0.95V	-	-	-	-	667MHz	256KB	-	Single ARM® Cortex®-A9 MPCore™ with CoreSight™	DMA	667MHz	-	-	CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG	MCU, FPGA	-	ARM	-	-	YES	-	256000	Artix™-7 FPGA, 23K Logic Cells	-	-	CAN; ETHERNET; I2C; PCI; SPI; UART; USB	-	1.5mm	13mm	13mm	-	ROHS3 Compliant
XC7Z007S-1CLG225C 903-492-XC7Z007S-1CLG225C Xilinx Inc. : : - : 1500 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: XC7Z010-2CLG400I,XC7Z030-1FBG676C,XC7Z020-2CLG400I,XC7Z035-2FFG676I,XC7Z045-2FFG676I.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134273),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - System On Chip (SoC) has 7695 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Elecinsight.

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Integrated Circuits (ICs)