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| Image | Part # | Manufacturer | Description | Pricing | Quantity | RoHS | Factory Lead Time | Contact Plating | Mount | Package / Case | Surface Mount | Number of Pins | Supplier Device Package | Number of Terminals | Base Product Number | Core | Data RAM Size | Factory Pack QuantityFactory Pack Quantity | Ihs Manufacturer | L1 Cache Data Memory | L1 Cache Instruction Memory | Manufacturer Part Number | Maximum Clock Frequency | Maximum Operating Temperature | Mfr | Minimum Operating Temperature | Moisture Sensitive | Moisture Sensitivity Levels | Mounting Styles | Number of I/Os | Number of Logic Array Blocks - LABs | Number of Logic Elements | Operating Temperature-Max | Package | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Product Status | Reflow Temperature-Max (s) | Risk Rank | RoHS | Rohs Code | Shipping Restrictions | Supply Voltage-Max | Supply Voltage-Min | Supply Voltage-Nom | Tradename | Typical Operating Supply Voltage | Unit Weight | Operating Temperature | Packaging | Published | Series | JESD-609 Code | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Terminal Finish | Additional Feature | HTS Code | Technology | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Terminal Pitch | Reach Compliance Code | Frequency | Time@Peak Reflow Temperature-Max (s) | Base Part Number | JESD-30 Code | Number of Outputs | Qualification Status | Operating Supply Voltage | Supply Voltage-Max (Vsup) | Power Supplies | Temperature Grade | Supply Voltage-Min (Vsup) | Interface | Speed | RAM Size | uPs/uCs/Peripheral ICs Type | Core Processor | Peripherals | Clock Frequency | Program Memory Size | Connectivity | Architecture | Data Bus Width | Number of Inputs | Seated Height-Max | Programmable Logic Type | Core Architecture | Number of Gates | Boundary Scan | Speed Grade | RAM (words) | Primary Attributes | Number of Logic Cells | Number of Cores | Bus Compatibility | Flash Size | UV Erasable | Height Seated (Max) | Length | Width | Radiation Hardening | RoHS Status |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
  | Mfr. Part #XCZU4EG-1SFVC784IElecinsight Part #903-492-XCZU4EG-1SFVC784I
IN STOCK: 600
| Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 192K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU4EG-1SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #XCZU7EV-2FFVC1156IElecinsight Part #903-492-XCZU7EV-2FFVC1156I
IN STOCK: 240
| Xilinx Inc. |
IC SOC CORTEX-A53 1156FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1156-BBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 360 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EV | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 533MHz, 600MHz, 1.3GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 504K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU7EV-2FFVC1156I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #A2F500M3G-1PQ208IElecinsight Part #536-492-A2F500M3G-1PQ208I | Microchip Technology |
SoC FPGA A2F500M3G-1PQ208I
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | 208-BFQFP | - | - | 208-PQFP (28x28) | - | A2F500M3G | ARM Cortex M3 | 64 kB | 24 | - | - | - | - | 100 MHz | + 100 C | Microchip Technology | - 40 C | Yes | - | SMD/SMT | 113 I/O | - | 6000 LE | - | Tray | - | - | - | - | - | - | - | Obsolete | - | - | N | - | This product may require additional documentation to export from the United States. | - | - | - | SmartFusion | - | 0.183425 oz | -40°C ~ 100°C (TJ) | Tray | - | A2F500 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 100MHz | 64KB | - | ARM® Cortex®-M3 | DMA, POR, WDT | - | 512 kB | Ethernet, I²C, SPI, UART/USART | MCU, FPGA | - | - | - | - | - | 500000 | - | - | - | ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops | - | 1 Core | - | 512KB | - | - | - | - | - | - | ||
| A2F500M3G-1PQ208I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #XCZU3CG-1SFVA625EElecinsight Part #903-492-XCZU3CG-1SFVA625E
IN STOCK: 2012
| Xilinx Inc. |
IC SOC CORTEX-A53 625FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 625-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 180 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Bulk | 2016 | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3CG-1SFVA625E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #XCZU19EG-L1FFVC1760IElecinsight Part #903-492-XCZU19EG-L1FFVC1760I
IN STOCK: 360
| Xilinx Inc. |
IC SOC CORTEX-A53 1760FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1760-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | ALSO AVAILABLE WITH 0.85V NOMINAL SUPPLY | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.72V | - | - | - | NOT SPECIFIED | - | R-PBGA-B1760 | - | - | - | 0.742V | - | - | 0.698V | - | 500MHz, 600MHz, 1.2GHz | 256KB | MICROPROCESSOR CIRCUIT | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU19EG-L1FFVC1760I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #XCZU2CG-1SFVC784EElecinsight Part #903-492-XCZU2CG-1SFVC784E
IN STOCK: 2446
| Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Zynq® UltraScale+™ MPSoC CG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 1.2GHz | 256KB | - | Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU2CG-1SFVC784E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2S150T-1FC1152IElecinsight Part #69-492-M2S150T-1FC1152I | Atmel (Microchip Technology) |
SoC FPGA M2S150T-1FC1152I
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | FCBGA-1152 | - | - | - | - | - | ARM Cortex M3 | 64 kB | 24 | - | - | - | - | 166 MHz | - | - | - | Yes | - | SMD/SMT | - | 12177 LAB | 146124 LE | - | - | - | - | - | - | - | - | - | - | - | - | N | - | - | - | - | - | - | - | 1.234218 oz | - | Tray | - | SmartFusion2 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 512 kB | - | - | - | - | - | - | - | - | - | - | - | - | - | 1 Core | - | - | - | - | - | - | - | - | ||
| M2S150T-1FC1152I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #XC7Z014S-1CLG484IElecinsight Part #903-492-XC7Z014S-1CLG484I
IN STOCK: 2265
| Xilinx Inc. |
IC SOC CORTEX-A9 667MHZ 484BGA
Datasheet
Compare
| Min.:1 Mult.:1 | 10 Weeks | - | - | 484-LFBGA, CSPBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 200 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq®-7000 | e3 | yes | Active | 3 (168 Hours) | 484 | - | Matte Tin (Sn) | - | 8542.31.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B484 | - | - | - | 1.05V | - | - | 0.95V | - | 667MHz | 256KB | - | Single ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | 667MHz | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | YES | - | 256000 | Artix™-7 FPGA, 65K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 1.6mm | 19mm | 19mm | - | ROHS3 Compliant | ||
| XC7Z014S-1CLG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #XC7Z045-L2FFG900IElecinsight Part #903-492-XC7Z045-L2FFG900I
IN STOCK: 701
| Xilinx Inc. |
IC SOC CORTEX-A9 800MHZ 900FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 10 Weeks | - | - | 900-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2010 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 900 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | 245 | 1V | 1mm | - | 800MHz | 30 | - | S-PBGA-B900 | - | - | - | 1.05V | - | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | ARM | - | YES | - | 256000 | Kintex™-7 FPGA, 350K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 3.35mm | 31mm | 31mm | - | ROHS3 Compliant | ||
| XC7Z045-L2FFG900I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #XC7Z030-3FFG676EElecinsight Part #903-492-XC7Z030-3FFG676E
IN STOCK: 2479
| Xilinx Inc. |
MPU Zynq-7000 Thumb-2 32-Bit 1GHz 1.2V/3.3V 676-Pin FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | - | 676-BBGA, FCBGA | YES | 676 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 676 | 3A991.D | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | - | BOTTOM | BALL | 245 | 1V | 1mm | - | 1GHz | 30 | XC7Z030 | - | - | - | 1V | 1.05V | - | - | - | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | - | YES | -3 | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | - | 3.24mm | 27mm | - | No | ROHS3 Compliant | ||
| XC7Z030-3FFG676E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2S050T-1FGG484IElecinsight Part #536-492-M2S050T-1FGG484I
IN STOCK: 2034
| Microchip Technology |
SoC FPGA M2S050T-1FGG484I
Datasheet
Compare
| Min.:1 Mult.:1 | - | - | - | FPBGA-484 | YES | - | 484-FPBGA (23x23) | 484 | M2S050 | ARM Cortex M3 | 64 kB | 60 | MICROSEMI CORP | - | - | M2S050T-1FGG484I | 166 MHz | - | Microchip Technology | - | Yes | 3 | SMD/SMT | 267 | 4695 LAB | 56340 LE | - | Tray | PLASTIC/EPOXY | BGA | FBGA-484 | BGA484,22X22,40 | SQUARE | GRID ARRAY | Active | Active | - | 5.76 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | - | - | -40°C ~ 100°C (TJ) | Tray | - | SmartFusion2 | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 1 mm | compliant | - | 40 | - | S-PBGA-B484 | 267 | Not Qualified | - | - | 1.2 V | - | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 267 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | 1 | - | FPGA - 50K Logic Modules | 56340 | 1 Core | - | 256KB | - | - | 23 mm | 23 mm | - | - | ||
| M2S050T-1FGG484I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #XCZU2EG-1SFVC784EElecinsight Part #903-492-XCZU2EG-1SFVC784E
IN STOCK: 2692
| Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2013 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 103K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU2EG-1SFVC784E | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #5CSEBA2U23C8NElecinsight Part #386-492-5CSEBA2U23C8N
IN STOCK: 10000
| Intel |
FPGA - Field Programmable Gate Array CycloneV SoC SE dual -core ARM Cortex-A9
Datasheet
Compare
| Min.:1 Mult.:1 | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 600MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Elements | 25000 | - | - | - | - | 1.85mm | 23mm | 23mm | - | RoHS Compliant | ||
| 5CSEBA2U23C8N | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #5CSEBA6U23C7NElecinsight Part #386-492-5CSEBA6U23C7N | Intel |
FPGA Cyclone® V SE Family 110000 Cells 28nm Technology 1.1V 672-Pin UFBGA Tray
Datasheet
Compare
| Min.:1 Mult.:1 | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | 5CSEBA6 | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 800MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 110K Logic Elements | 110000 | - | - | - | - | 1.85mm | 23mm | 23mm | - | RoHS Compliant | ||
| 5CSEBA6U23C7N | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #M2S050T-FGG896Elecinsight Part #536-492-M2S050T-FGG896
IN STOCK: 2869
| Microchip Technology |
SoC FPGA M2S050T-FGG896
Datasheet
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| Min.:1 Mult.:1 | - | - | - | FPBGA-896 | YES | - | 896-FBGA (31x31) | 896 | M2S050 | ARM Cortex M3 | 64 kB | 27 | MICROSEMI CORP | - | - | M2S050T-FGG896 | 166 MHz | + 85 C | Microchip Technology | 0 C | Yes | - | SMD/SMT | 377 I/O | 4695 LAB | 56340 LE | 85 °C | Tray | PLASTIC/EPOXY | BGA | FBGA-896 | BGA896,30X30,40 | SQUARE | GRID ARRAY | Active | Active | 40 | 2.31 | Details | Yes | This product may require additional documentation to export from the United States. | 1.26 V | 1.14 V | 1.2 V | - | 1.2000 V | - | 0 to 85 °C | Tray | - | SmartFusion2 | e1 | - | - | - | - | - | Tin/Silver/Copper (Sn/Ag/Cu) | - | 8542.39.00.01 | CMOS | BOTTOM | BALL | 250 | - | 1 mm | compliant | - | - | - | S-PBGA-B896 | 377 | Not Qualified | 1.2 V | - | 1.2 V | OTHER | - | - | 166MHz | 64KB | - | ARM® Cortex®-M3 | DDR, PCIe, SERDES | - | 256 kB | CANbus, Ethernet, I²C, SPI, UART/USART, USB | MCU, FPGA | - | 377 | 2.44 mm | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | STD | - | FPGA - 50K Logic Modules | 56340 | 1 Core | - | 256KB | - | - | 31 mm | 31 mm | - | - | ||
| M2S050T-FGG896 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #10AS066H3F34E2SGElecinsight Part #386-492-10AS066H3F34E2SG
IN STOCK: 5624
| Intel |
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Datasheet
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| Min.:1 Mult.:1 | 8 Weeks | - | - | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 492 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | - | 0.93V | 0.9V | - | 0.87V | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 492 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 660K Logic Elements | 660000 | - | - | - | - | 3.65mm | 35mm | 35mm | - | RoHS Compliant | ||
| 10AS066H3F34E2SG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #5CSEBA2U23C6NElecinsight Part #386-492-5CSEBA2U23C6N
IN STOCK: 12
| Intel |
IC SOC CORTEX-A9 925MHZ 672UBGA
Datasheet
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| Min.:1 Mult.:1 | 8 Weeks | - | - | 672-FBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | MCU - 181, FPGA - 145 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~85°C TJ | Tray | 2018 | Cyclone® V SE | - | - | Active | 3 (168 Hours) | 672 | - | - | - | - | - | BOTTOM | BALL | NOT SPECIFIED | 1.1V | 0.8mm | - | - | NOT SPECIFIED | - | S-PBGA-B672 | 145 | Not Qualified | - | 1.13V | 1.11.2/3.32.5V | - | 1.07V | - | 925MHz | 64KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 145 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 25K Logic Elements | 25000 | - | - | - | - | 1.85mm | 23mm | 23mm | - | RoHS Compliant | ||
| 5CSEBA2U23C6N | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #XCZU3EG-1SFVC784IElecinsight Part #903-492-XCZU3EG-1SFVC784I
IN STOCK: 823
| Xilinx Inc. |
IC SOC CORTEX-A53 784FCBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 784-BFBGA, FCBGA | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 252 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | -40°C~100°C TJ | Tray | 2016 | Zynq® UltraScale+™ MPSoC EG | - | - | Active | 4 (72 Hours) | - | - | - | - | 8542.31.00.01 | - | - | - | NOT SPECIFIED | - | - | - | - | NOT SPECIFIED | - | - | - | - | - | - | - | - | - | - | 500MHz, 600MHz, 1.2GHz | 256KB | - | Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2 | DMA, WDT | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | - | - | - | - | - | - | - | - | Zynq®UltraScale+™ FPGA, 154K+ Logic Cells | - | - | - | - | - | - | - | - | - | ROHS3 Compliant | ||
| XCZU3EG-1SFVC784I | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| | Mfr. Part #10AS048H3F34E2SGElecinsight Part #386-492-10AS048H3F34E2SG
IN STOCK: 1553
| Intel |
IC SOC CORTEX-A9 1.5GHZ 1152FBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 11 Weeks | - | - | 1152-BBGA, FCBGA | YES | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 492 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | - | Arria 10 SX | - | - | Active | 3 (168 Hours) | - | - | - | - | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 0.9V | 1mm | - | - | NOT SPECIFIED | - | S-PBGA-B1152 | 492 | Not Qualified | - | 0.93V | 0.9V | - | 0.87V | - | 1.5GHz | 256KB | - | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA, POR, WDT | - | - | EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | - | 492 | - | FIELD PROGRAMMABLE GATE ARRAY | - | - | - | - | - | FPGA - 480K Logic Elements | 480000 | - | - | - | - | 3.65mm | 35mm | 35mm | - | RoHS Compliant | ||
| 10AS048H3F34E2SG | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 | Mfr. Part #XC7Z030-3SBG485EElecinsight Part #903-492-XC7Z030-3SBG485E
IN STOCK: 2147
| Xilinx Inc. |
MPU Zynq-7000 RISC 32-Bit 1000MHz 1.5V/2V/2.5V 485-Pin FBGA
Datasheet
Compare
| Min.:1 Mult.:1 | 10 Weeks | Copper, Silver, Tin | Surface Mount | 484-FBGA, FCBGA | - | 485 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 130 | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | - | 0°C~100°C TJ | Tray | 2009 | Zynq®-7000 | e1 | - | Active | 4 (72 Hours) | 485 | EAR99 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | PL BLOCK OPERATES IN 0.97V TO 1.03V SUPPLY | 8542.39.00.01 | - | BOTTOM | BALL | NOT SPECIFIED | 1V | 0.8mm | - | 1GHz | NOT SPECIFIED | - | - | - | Not Qualified | - | 1.05V | 11.8V | - | 0.95V | CAN, EBI/EMI, Ethernet, I2C, MMC, SD, SDIO, SPI, UART, USART, USB | - | 256KB | MICROPROCESSOR CIRCUIT | Dual ARM® Cortex®-A9 MPCore™ with CoreSight™ | DMA | - | - | CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG | MCU, FPGA | 32b | - | - | - | ARM | - | YES | - | 256000 | Kintex™-7 FPGA, 125K Logic Cells | - | - | CAN; ETHERNET; I2C; SPI; UART; USB | - | N | 2.44mm | 19mm | - | - | ROHS3 Compliant | ||
| XC7Z030-3SBG485E |
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