Memory Products For Sale - PDF - Integrated Circuits (ICs) -Page49

Image	Part #	Manufacturer	Description	Pricing	Quantity	RoHS	Factory Lead Time	Lifecycle Status	Mounting Type	Package / Case	Surface Mount	Mounting Feature	Shell Material	Supplier Device Package	Number of Terminals	Active Read Current - Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Contact Finish Mating	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Shape	Package Style	Part Life Cycle Code	Primary Material	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Voltage, Rating	Operating Temperature	Packaging	Series	Size / Dimension	Tolerance	JESD-609 Code	Number of Terminations	Termination	ECCN Code	Temperature Coefficient	Connector Type	Type	Resistance	Number of Positions	Terminal Finish	Composition	Color	Power (Watts)	Additional Feature	HTS Code	Fastening Type	Subcategory	Current Rating (Amps)	Technology	Voltage - Supply	Terminal Position	Orientation	Terminal Form	Shielding	Peak Reflow Temperature (Cel)	Number of Functions	Ingress Protection	Terminal Pitch	Reach Compliance Code	Shell Finish	Pin Count	Shell Size - Insert	JESD-30 Code	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Memory Size	Number of Ports	Speed	Current - Reverse Leakage @ Vr	Operating Mode	Shell Size, MIL	Voltage - Forward (Vf) (Max) @ If	Clock Frequency	Access Time	Memory Format	Memory Interface	Data Bus Width	Operating Temperature - Junction	Organization	Seated Height-Max	Memory Width	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Write Cycle Time - Word, Page	Product Type	Density	Memory Density	Capacitance @ Vr, F	Parallel/Serial	Memory IC Type	Programming Voltage	Access Mode	Reverse Recovery Time (trr)	Features	Self Refresh	Product Category	Memory Organization	Height Seated (Max)	Length	Width	Contact Finish Thickness - Mating	Ratings

Image	Part #	Manufacturer	Description	Quantity	Factory Lead Time	Lifecycle Status	Mounting Type	Package / Case	Surface Mount	Mounting Feature	Shell Material	Supplier Device Package	Number of Terminals	Active Read Current - Max	Base Product Number	Brand	Clock Frequency-Max (fCLK)	Contact Finish Mating	Factory Pack QuantityFactory Pack Quantity	Ihs Manufacturer	Interface Type	Manufacturer	Manufacturer Part Number	Maximum Clock Frequency	Maximum Operating Temperature	Memory Types	Mfr	Minimum Operating Temperature	Mounting Styles	Number of Words	Number of Words Code	Operating Temperature-Max	Operating Temperature-Min	Package	Package Body Material	Package Code	Package Description	Package Shape	Package Style	Part Life Cycle Code	Primary Material	Product Status	Reflow Temperature-Max (s)	Risk Rank	RoHS	Rohs Code	Supplier Package	Supply Voltage-Max	Supply Voltage-Min	Supply Voltage-Nom (Vsup)	Voltage, Rating	Operating Temperature	Packaging	Series	Size / Dimension	Tolerance	JESD-609 Code	Number of Terminations	Termination	ECCN Code	Temperature Coefficient	Connector Type	Type	Resistance	Number of Positions	Terminal Finish	Composition	Color	Power (Watts)	Additional Feature	HTS Code	Fastening Type	Subcategory	Current Rating (Amps)	Technology	Voltage - Supply	Terminal Position	Orientation	Terminal Form	Shielding	Peak Reflow Temperature (Cel)	Number of Functions	Ingress Protection	Terminal Pitch	Reach Compliance Code	Shell Finish	Pin Count	Shell Size - Insert	JESD-30 Code	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Temperature Grade	Supply Voltage-Min (Vsup)	Max Supply Voltage	Min Supply Voltage	Memory Size	Number of Ports	Speed	Current - Reverse Leakage @ Vr	Operating Mode	Shell Size, MIL	Voltage - Forward (Vf) (Max) @ If	Clock Frequency	Access Time	Memory Format	Memory Interface	Data Bus Width	Operating Temperature - Junction	Organization	Seated Height-Max	Memory Width	Voltage - DC Reverse (Vr) (Max)	Current - Average Rectified (Io)	Write Cycle Time - Word, Page	Product Type	Density	Memory Density	Capacitance @ Vr, F	Parallel/Serial	Memory IC Type	Programming Voltage	Access Mode	Reverse Recovery Time (trr)	Features	Self Refresh	Product Category	Memory Organization	Height Seated (Max)	Length	Width	Contact Finish Thickness - Mating	Ratings
	Mfr. Part # MT53E1536M32D4DE-046 WT:C TR Elecinsight Part # 533-535-MT53E1536M32D4DE-046 WT:C TR IN STOCK: 9	Micron Technology	LPDDR4 48G 1.5GX32 FBGA Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	200-TFBGA	-	-	-	200-TFBGA (10x14.5)	-	-	-	Micron	-	-	1360	-	-	Micron Technology	-	-	-	Volatile	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-25°C ~ 85°C (TC)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	SDRAM - Mobile LPDDR4X	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	48Gbit	-	-	-	-	-	-	2.133 GHz	3.5 ns	DRAM	Parallel	-	-	-	-	-	-	-	18ns	DRAM	-	-	-	-	-	-	-	-	-	-	DRAM	1.5G x 32	-	-	-	-	-
MT53E1536M32D4DE-046 WT:C TR 533-535-MT53E1536M32D4DE-046 WT:C TR Micron Technology RoHS : Package : - In Stock : 9 1 : -
	Mfr. Part # MTFDDAK3T8TGB-1BC1ZABYY Elecinsight Part # 533-535-MTFDDAK3T8TGB-1BC1ZABYY IN STOCK: 18	Micron Technology	5400 MAX 3840GB 2.5 SSD Datasheet Compare	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	5400 MAX	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MTFDDAK3T8TGB-1BC1ZABYY 533-535-MTFDDAK3T8TGB-1BC1ZABYY Micron Technology RoHS : Package : - In Stock : 18 1 : -
	Mfr. Part # MT62F1G32D2DS-023 WT:B TR Elecinsight Part # 533-535-MT62F1G32D2DS-023 WT:B TR IN STOCK: 9	Micron Technology	LPDDR5 32G 1GX32 FBGA Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	200-WFBGA	-	-	-	200-WFBGA (10x14.5)	-	-	-	Micron	-	-	2000	-	-	Micron Technology	-	-	-	Volatile	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	Details	-	-	-	-	-	-	-25°C ~ 85°C	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	SDRAM - Mobile LPDDR5	1.05V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	32Gbit	-	-	-	-	-	-	3.2 GHz	-	DRAM	Parallel	-	-	1 G x 32	-	-	-	-	-	DRAM	-	-	-	-	-	-	-	-	-	-	DRAM	1G x 32	-	-	-	-	-
MT62F1G32D2DS-023 WT:B TR 533-535-MT62F1G32D2DS-023 WT:B TR Micron Technology RoHS : Package : - In Stock : 9 1 : -
	Mfr. Part # MT62F768M64D4ZU-023 WT:B Elecinsight Part # 533-535-MT62F768M64D4ZU-023 WT:B	Micron Technology	DRAM Chip LPDDR5 48Gbit 768M X 64 6400 MB/s FBGA Datasheet Compare	Min.:1 Mult.:1	-	-	-	FBGA	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	SMD/SMT	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	140S	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MT62F768M64D4ZU-023 WT:B 533-535-MT62F768M64D4ZU-023 WT:B Micron Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT53E1G32D2FW-046 AUT:B TR Elecinsight Part # 533-535-MT53E1G32D2FW-046 AUT:B TR IN STOCK: 43	Micron Technology	LPDDR4 32G 1GX32 FBGA DDP Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	200-TFBGA	-	-	-	200-TFBGA (10x14.5)	-	-	-	Micron	-	-	2000	-	-	Micron Technology	-	-	-	Volatile	Micron Technology Inc.	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	Details	-	-	-	-	-	-	-40°C ~ 125°C (TC)	-	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	SDRAM - Mobile LPDDR4X	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	32Gbit	-	-	-	-	-	-	2.133 GHz	3.5 ns	DRAM	Parallel	-	-	1 G x 32	-	-	-	-	18ns	DRAM	-	-	-	-	-	-	-	-	-	-	DRAM	1G x 32	-	-	-	-	-
MT53E1G32D2FW-046 AUT:B TR 533-535-MT53E1G32D2FW-046 AUT:B TR Micron Technology RoHS : Package : - In Stock : 43 1 : -
	Mfr. Part # MTFC16GAKAENA-4M IT ES Elecinsight Part # 533-535-MTFC16GAKAENA-4M IT ES	Micron Technology	Flash Card 16G-byte 3.3V Embedded MMC 100-Pin TBGA Datasheet Compare	Min.:1 Mult.:1	-	-	Through Hole	DO-204AL, DO-41, Axial	-	-	-	DO-41	-	-	UF4007	-	-	-	-	-	-	-	-	-	-	-	Micro Commercial Co	-	-	-	-	-	-	Bulk	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-40 to 85 °C	-	-	-	-	-	-	-	-	-	-	Embedded MMC	-	-	-	-	-	-	-	-	-	-	-	Standard	-	-	-	-	-	-	-	-	-	-	-	100	-	-	3.3000 V	-	-	-	-	-	-	-	Fast Recovery =< 500ns, > 200mA (Io)	5 µA @ 1000 V	-	-	1.7 V @ 1 A	-	-	-	-	-	-55°C ~ 150°C	-	-	-	1000 V	1A	-	-	-	16	10pF @ 4V, 1MHz	-	-	-	-	75 ns	-	-	-	-	-	-	-	-	-
MTFC16GAKAENA-4M IT ES 533-535-MTFC16GAKAENA-4M IT ES Micron Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT38W2021A502ZQXZI.X69 Elecinsight Part # 533-535-MT38W2021A502ZQXZI.X69	Micron Technology	PARALLEL/PSRAM 96M Datasheet Compare	Min.:1 Mult.:1	-	-	-	-	YES	-	-	-	88	-	-	-	-	-	-	MICRON TECHNOLOGY INC	-	Micron Technology Inc	MT38W2021A502ZQXZI.X69	-	-	-	-	-	-	4194304 words	4000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	TFBGA,	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	-	-	-	5.8	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	IT ALSO CONTAINS 32MBIT(2MBIT X 16) PSRAM	8542.32.00.71	-	-	-	CMOS	-	BOTTOM	-	BALL	-	-	1	-	0.8 mm	unknown	-	-	-	R-PBGA-B88	-	1.95 V	INDUSTRIAL	1.7 V	-	-	-	-	-	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	4MX16	1.2 mm	16	-	-	-	-	-	67108864 bit	-	-	MEMORY CIRCUIT	-	-	-	-	-	-	-	-	10 mm	8 mm	-	-
MT38W2021A502ZQXZI.X69 533-535-MT38W2021A502ZQXZI.X69 Micron Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT35XL02GCBA2G12-0SIT Elecinsight Part # 533-535-MT35XL02GCBA2G12-0SIT IN STOCK: 2500	Micron Technology	Serial NOR Flash Memory 2Gbit 256M X 8Bit 3.3V 24-Pin T-PBGA Tray Datasheet Compare	Min.:1 Mult.:1	7 Weeks	Production (Last Updated: 2 years ago)	-	-	YES	-	-	-	24	-	-	-	133 MHz	-	-	MICRON TECHNOLOGY INC	-	Micron Technology Inc	MT35XL02GCBA2G12-0SIT	-	-	-	PEI-Genesis	-	-	268435456 words	256000000	85 °C	-40 °C	Bulk	PLASTIC/EPOXY	TBGA	TBGA-24	RECTANGULAR	GRID ARRAY, THIN PROFILE	Active	-	Active	30	5.79	-	Yes	-	-	-	3 V	-	-	-	*	-	-	e1	-	-	-	-	-	-	-	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	-	-	-	-	-	CMOS	-	BOTTOM	-	BALL	-	260	1	-	1 mm	compliant	-	-	-	R-PBGA-B24	-	3.6 V	INDUSTRIAL	2.7 V	3.6 V	2.7 V	-	-	-	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	256MX8	1.2 mm	8	-	-	-	-	2 Gb	2147483648 bit	-	SERIAL	FLASH	3 V	-	-	-	-	-	-	-	8 mm	6 mm	-	-
MT35XL02GCBA2G12-0SIT 533-535-MT35XL02GCBA2G12-0SIT Micron Technology RoHS : Package : - In Stock : 2500 1 : -
	Mfr. Part # MT38L3031AA03JVZZI.X7A Elecinsight Part # 533-535-MT38L3031AA03JVZZI.X7A	Micron Technology	Multichip Packages, NOR-Based MCP, 128Mb, PSRAM (Sync) 64Mb, 1.8V, 56-ball TFBGA, RoHS Datasheet Compare	Min.:1 Mult.:1	-	-	-	-	YES	-	-	-	56	-	-	-	-	-	-	MICRON TECHNOLOGY INC	-	Micron Technology Inc	MT38L3031AA03JVZZI.X7A	-	-	-	-	-	-	8388608 words	8000000	85 °C	-40 °C	-	PLASTIC/EPOXY	TFBGA	TFBGA,	RECTANGULAR	GRID ARRAY, THIN PROFILE, FINE PITCH	Obsolete	-	-	-	5.82	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	IT ALSO CONTAINS 64MBIT(4MBIT X 16) PSRAM	8542.32.00.71	-	-	-	CMOS	-	BOTTOM	-	BALL	-	-	1	-	0.5 mm	unknown	-	-	-	R-PBGA-B56	-	1.95 V	INDUSTRIAL	1.7 V	-	-	-	-	-	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	8MX16	1.2 mm	16	-	-	-	-	-	134217728 bit	-	-	MEMORY CIRCUIT	-	-	-	-	-	-	-	-	8 mm	6 mm	-	-
MT38L3031AA03JVZZI.X7A 533-535-MT38L3031AA03JVZZI.X7A Micron Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT53E1G32D2FW-046 AIT:C Elecinsight Part # 533-535-MT53E1G32D2FW-046 AIT:C IN STOCK: 39	Micron Technology	IC DRAM 32GBIT 2.133GHZ 200VFBGA Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	0603 (1608 Metric)	-	-	-	0603	-	-	RS73G1J	Micron	-	-	1360	-	-	Micron Technology	-	-	-	Volatile	KOA Speer Electronics, Inc.	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-55°C ~ 155°C	-	RS73	0.063 L x 0.031 W (1.60mm x 0.80mm)	±0.25%	-	2	-	-	±50ppm/°C	-	-	14.7 kOhms	-	-	Thick Film	-	0.2W, 1/5W	-	-	-	-	-	SDRAM - Mobile LPDDR4X	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	32Gbit	-	-	-	-	-	-	2.133 GHz	3.5 ns	DRAM	Parallel	-	-	-	-	-	-	-	18ns	-	-	-	-	-	-	-	-	-	Automotive AEC-Q200, Moisture Resistant	-	Micron	1G x 32	0.022 (0.55mm)	-	-	-	AEC-Q200
MT53E1G32D2FW-046 AIT:C 533-535-MT53E1G32D2FW-046 AIT:C Micron Technology RoHS : Package : - In Stock : 39 1 : -
	Mfr. Part # EDFP164A1PB-GD-F-D Elecinsight Part # 533-535-EDFP164A1PB-GD-F-D	Micron Technology	MIXED LPDDR3 24G Datasheet Compare	Min.:1 Mult.:1	-	-	-	-	YES	-	-	-	216	-	-	-	-	-	-	MICRON TECHNOLOGY INC	-	Micron Technology Inc	EDFP164A1PB-GD-F-D	-	-	-	-	-	-	402653184 words	384000000	85 °C	-30 °C	-	PLASTIC/EPOXY	VFBGA	FBGA-216	SQUARE	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	Active	-	-	NOT SPECIFIED	5.74	Non-Compliant	Yes	-	-	-	1.2 V	-	-	-	-	-	-	-	-	-	EAR99	-	-	-	-	-	-	-	-	-	AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM	-	-	-	-	CMOS	-	BOTTOM	-	BALL	-	NOT SPECIFIED	1	-	0.5 mm	compliant	-	-	-	S-PBGA-B216	-	1.3 V	OTHER	1.14 V	-	-	-	1	-	-	SYNCHRONOUS	-	-	-	-	-	-	-	-	384MX64	0.82 mm	64	-	-	-	-	-	25769803776 bit	-	-	DDR DRAM	-	DUAL BANK PAGE BURST	-	-	YES	-	-	-	15 mm	15 mm	-	-
EDFP164A1PB-GD-F-D 533-535-EDFP164A1PB-GD-F-D Micron Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT53E1G32D2FW-046 AIT:A Elecinsight Part # 533-535-MT53E1G32D2FW-046 AIT:A	Micron Technology	LPDDR4 32G 1GX32 FBGA DDP Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	200-TFBGA	-	-	-	200-TFBGA (10x14.5)	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	Micron Technology Inc.	-	-	-	-	-	-	Box	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-40°C ~ 95°C (TC)	-	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	SDRAM - Mobile LPDDR4X	1.06V ~ 1.17V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	32Gbit	-	-	-	-	-	-	2.133 GHz	-	DRAM	Parallel	-	-	-	-	-	-	-	18ns	-	-	-	-	-	-	-	-	-	-	-	-	1G x 32	-	-	-	-	-
MT53E1G32D2FW-046 AIT:A 533-535-MT53E1G32D2FW-046 AIT:A Micron Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT62F512M32D2DS-031 AUT:B TR Elecinsight Part # 533-535-MT62F512M32D2DS-031 AUT:B TR IN STOCK: 21	Micron Technology	LPDDR5 16G 512MX32 FBGA DDP Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	200-WFBGA	-	-	-	200-WFBGA (10x14.5)	-	-	-	-	-	-	-	-	-	-	-	-	-	Volatile	Micron Technology Inc.	-	-	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-40°C ~ 125°C	-	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	SDRAM - Mobile LPDDR5	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	16Gbit	-	-	-	-	-	-	3.2 GHz	-	DRAM	Parallel	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	512M x 32	-	-	-	-	-
MT62F512M32D2DS-031 AUT:B TR 533-535-MT62F512M32D2DS-031 AUT:B TR Micron Technology RoHS : Package : - In Stock : 21 1 : -
	Mfr. Part # MT29F4T08EULGEM4-ITF:G Elecinsight Part # 533-535-MT29F4T08EULGEM4-ITF:G IN STOCK: 40000	Micron Technology	TLC 4T X8 LBGA Datasheet Compare	Min.:1 Mult.:1	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Micron Technology Inc.	-	-	-	-	-	-	Box	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MT29F4T08EULGEM4-ITF:G 533-535-MT29F4T08EULGEM4-ITF:G Micron Technology RoHS : Package : - In Stock : 40000 1 : -
	Mfr. Part # MT60B2G8HB-56B:G Elecinsight Part # 533-535-MT60B2G8HB-56B:G IN STOCK: 140	Micron Technology	DDR5 16G 2GX8 FBGA Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	82-VFBGA	-	-	-	82-VFBGA (9x11)	-	-	-	Micron	-	-	1260	-	-	Micron Technology	-	-	-	Volatile	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	Box	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	0°C ~ 95°C (TC)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	SDRAM - DDR5	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	16Gbit	-	-	-	-	-	-	2.8 GHz	16 ns	DRAM	POD	-	-	-	-	-	-	-	-	DRAM	-	-	-	-	-	-	-	-	-	-	DRAM	2G x 8	-	-	-	-	-
MT60B2G8HB-56B:G 533-535-MT60B2G8HB-56B:G Micron Technology RoHS : Package : - In Stock : 140 1 : -
	Mfr. Part # MT60B2G8HB-52B IT:G TR Elecinsight Part # 533-535-MT60B2G8HB-52B IT:G TR	Micron Technology	DDR5 16G 2GX8 FBGA Datasheet Compare	Min.:1 Mult.:1	-	-	-	FBGA	-	-	-	-	-	-	-	Micron	-	-	1260	-	-	Micron Technology	-	-	-	-	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	DRAM	-	-	-	-	-	-	-	-	-	-	DRAM	-	-	-	-	-	-
MT60B2G8HB-52B IT:G TR 533-535-MT60B2G8HB-52B IT:G TR Micron Technology RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MTFC128GAZAQJP-IT TR Elecinsight Part # 533-535-MTFC128GAZAQJP-IT TR	Micron Technology Inc.	IC FLASH 128GB EMMC 153VFPGA Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	153-VFBGA	-	-	-	153-VFBGA (11.5x13)	-	-	MTFC128	-	-	-	-	-	-	-	-	-	-	Non-Volatile	Micron Technology Inc.	-	SMD/SMT	-	-	-	-	Tape & Reel (TR)	-	-	-	-	-	-	-	Active	-	-	-	-	VFBGA	-	-	-	-	-40°C ~ 85°C (TA)	-	-	-	-	-	-	-	-	-	-	Embedded MMC	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	-	2.7V ~ 3.6V	-	-	-	-	-	-	-	-	-	-	153	-	-	3.3 V	-	-	-	-	-	1Tbit	-	-	-	-	-	-	200 MHz	-	FLASH	eMMC	-	-	-	-	-	-	-	-	eMMC	128 GB	-	-	-	-	-	-	-	-	-	-	128G x 8	-	-	-	-	-
MTFC128GAZAQJP-IT TR 533-535-MTFC128GAZAQJP-IT TR Micron Technology Inc. RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT29F16G08ABACAWP-AAT:C TR Elecinsight Part # 533-535-MT29F16G08ABACAWP-AAT:C TR IN STOCK: 1553	Micron Technology Inc.	IC FLASH 16GB PARALLEL 48TSOP I Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	48-TFSOP (0.724", 18.40mm Width)	-	-	-	48-TSOP I	-	-	MT29F16G08	Micron	-	-	1000	-	-	Micron Technology	-	-	+ 105 C	Non-Volatile	Micron Technology Inc.	- 40 C	SMD/SMT	-	-	-	-	-	-	-	-	-	-	-	-	Active	-	-	-	-	-	-	-	-	-	-40°C ~ 105°C (TA)	Reel	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	Memory & Data Storage	-	-	2.7V ~ 3.6V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	16Gbit	-	-	-	-	-	-	-	20 ns	FLASH	ONFI	8 bit	-	2 G x 8	-	-	-	-	20ns	NAND Flash	-	-	-	-	-	-	-	-	-	-	NAND Flash	2G x 8	-	-	-	-	-
MT29F16G08ABACAWP-AAT:C TR 533-535-MT29F16G08ABACAWP-AAT:C TR Micron Technology Inc. RoHS : Package : - In Stock : 1553 1 : -
	Mfr. Part # MT25QL128ABB8E12-CAUT Elecinsight Part # 533-535-MT25QL128ABB8E12-CAUT	Micron Technology Inc.	128MB 3V BGA AUT AUTHENTA Datasheet Compare	Min.:1 Mult.:1	-	-	Surface Mount	24-TBGA	-	-	-	24-T-PBGA (6x8)	-	31 mA	-	-	-	-	-	-	SPI	-	-	133 MHz	+ 125 C	Non-Volatile	Micron Technology Inc.	- 40 C	SMD/SMT	-	-	-	-	Tray	-	-	-	-	-	-	-	Active	-	-	-	-	-	3.6 V	2.7 V	-	-	-40°C ~ 125°C (TA)	-	Automotive, AEC-Q100	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	2.7V ~ 3.6V	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	128Mbit	-	-	-	-	-	-	133 MHz	5 ns	FLASH	SPI - Quad I/O	8 bit	-	16 M x 8	-	-	-	-	1.8ms	-	-	-	-	-	-	-	-	-	-	-	-	16M x 8	-	-	-	-	-
MT25QL128ABB8E12-CAUT 533-535-MT25QL128ABB8E12-CAUT Micron Technology Inc. RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # MT25QL01GBBB8E12-1SIT Elecinsight Part # 533-535-MT25QL01GBBB8E12-1SIT	Micron Technology	NOR FLASH 256MX4 PLASTIC PBF TBGA 3.0V MASS STORAGE IND TE Datasheet Compare	Min.:1 Mult.:1	-	-	Panel Mount	-	-	Flange	Aluminum Alloy	-	-	-	CIR00	-	-	Silver	-	-	-	-	-	-	-	-	ITT Cannon, LLC	-	-	-	-	-	-	Bulk	-	-	-	-	-	-	Metal	Active	-	-	-	-	-	-	-	-	500VAC, 700VDC	-55°C ~ 125°C	-	CIR	-	-	-	-	Crimp	-	-	Receptacle, Female Sockets	-	-	5	-	-	Olive Drab	-	-	-	Bayonet Lock	-	23A, 80A	-	-	-	N (Normal)	-	-	-	-	Environment Proof	-	-	Olive Drab Cadmium	-	24-12	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-
MT25QL01GBBB8E12-1SIT 533-535-MT25QL01GBBB8E12-1SIT Micron Technology RoHS : Package : - In Stock : - 1 : -

Integrated Circuits (ICs)

Memory definition: Memory is a component used to store programs and various data information. A memory cell is actually a type of sequential logic circuit. A m... Memory Product Listing: MT53E1536M32D4DE-046 WT:C TR,MTFDDAK3T8TGB-1BC1ZABYY,MT62F1G32D2DS-023 WT:B TR,MT62F768M64D4ZU-023 WT:B,MT53E1G32D2FW-046 AUT:B TR.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134263),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Memory has 10000 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Elecinsight.

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