- All Products
- /
- Memory Cards, Modules
- /
- Memory - Modules
Image | Part # | Manufacturer | Description | Pricing | Quantity | RoHS | Surface Mount | Number of Terminals | Access Time-Max | Ihs Manufacturer | Number of Words | Number of Words Code | Operating Temperature-Max | Operating Temperature-Min | Package Body Material | Package Code | Package Description | Package Equivalence Code | Package Shape | Package Style | Part Life Cycle Code | Part Package Code | Rohs Code | Supply Voltage-Nom (Vsup) | JESD-609 Code | ECCN Code | Type | Terminal Finish | Additional Feature | HTS Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Number of Functions | Terminal Pitch | Reach Compliance Code | Time@Peak Reflow Temperature-Max (s) | Pin Count | JESD-30 Code | Qualification Status | Supply Voltage-Max (Vsup) | Temperature Grade | Supply Voltage-Min (Vsup) | Operating Mode | Supply Current-Max | Organization | Seated Height-Max | Memory Width | Standby Current-Max | Memory Density | Screening Level | Parallel/Serial | Memory IC Type | Programming Voltage | Alternate Memory Width | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Sector Size | Length | Width |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Mfr. Part #AS8F512K32Q-90Elecinsight Part #4046-630-AS8F512K32Q-90 | Micross Components |
Flash Module
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 68 | 90 ns | MICROSS COMPONENTS | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFP | QFP, QFP68,.99SQ,50 | QFP68,.99SQ,50 | SQUARE | FLATPACK | Active | - | No | 5 V | - | 3A001.A.2.C | NOR TYPE | - | ALSO HAVING 8-BIT WIDTH | 8542.32.00.51 | QUAD | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | - | S-CQFP-G68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.24 mA | 512KX32 | 3.937 mm | 32 | 0.0065 A | 16777216 bit | MIL-STD-883 | PARALLEL | FLASH MODULE | 5 V | 16 | YES | YES | - | 32 | 16K | 22.352 mm | 22.352 mm | |||
AS8F512K32Q-90 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #AS8F512K32P-150Elecinsight Part #4046-630-AS8F512K32P-150 | Micross Components |
Flash Module
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 66 | 150 ns | MICROSS COMPONENTS | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | PGA | PGA, PGA66,11X11 | PGA66,11X11 | SQUARE | GRID ARRAY | Active | - | No | 5 V | - | 3A001.A.2.C | NOR TYPE | - | ALSO HAVING 8-BIT WIDTH | 8542.32.00.51 | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 1 | 2.54 mm | compliant | NOT SPECIFIED | - | S-CPGA-P66 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.24 mA | 512KX32 | - | 32 | 0.0065 A | 16777216 bit | MIL-STD-883 | PARALLEL | FLASH MODULE | 5 V | 16 | YES | YES | - | 32 | 16K | 29.718 mm | 29.718 mm | |||
AS8F512K32P-150 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #AS8F512K32Q-120Elecinsight Part #4046-630-AS8F512K32Q-120 | Micross Components |
Flash Module
Datasheet
Compare
| Min.:1 Mult.:1 | YES | 68 | 120 ns | MICROSS COMPONENTS | 524288 words | 512000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | QFP | QFP, QFP68,.99SQ,50 | QFP68,.99SQ,50 | SQUARE | FLATPACK | Active | - | No | 5 V | - | 3A001.A.2.C | NOR TYPE | - | ALSO HAVING 8-BIT WIDTH | 8542.32.00.51 | QUAD | GULL WING | NOT SPECIFIED | 1 | 1.27 mm | compliant | NOT SPECIFIED | - | S-CQFP-G68 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.24 mA | 512KX32 | 3.937 mm | 32 | 0.0065 A | 16777216 bit | MIL-STD-883 | PARALLEL | FLASH MODULE | 5 V | 16 | YES | YES | - | 32 | 16K | 22.352 mm | 22.352 mm | |||
AS8F512K32Q-120 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
Mfr. Part #5962-9669005HYCElecinsight Part #4046-630-5962-9669005HYC | Micross Components |
Flash Module
Datasheet
Compare
| Min.:1 Mult.:1 | NO | 32 | 60 ns | MICROSS COMPONENTS | 131072 words | 128000 | 125 °C | -55 °C | CERAMIC, METAL-SEALED COFIRED | DIP | DIP, DIP32,.6 | DIP32,.6 | RECTANGULAR | MICROELECTRONIC ASSEMBLY | Active | MODULE | - | 5 V | e4 | 3A001.A.2.C | NOR TYPE | GOLD | 100K ERASE/PROGRAM CYCLES | 8542.32.00.51 | DUAL | THROUGH-HOLE | - | 1 | 2.54 mm | compliant | - | 32 | R-XDIP-T32 | Not Qualified | 5.5 V | MILITARY | 4.5 V | ASYNCHRONOUS | 0.05 mA | 128KX8 | - | 8 | 0.0016 A | 1048576 bit | 38535Q/M;38534H;883B | PARALLEL | FLASH MODULE | 5 V | - | YES | YES | NO | 8 | 16K | - | - | |||
5962-9669005HYC |
Index :
0123456789ABCDEFGHIJKLMNOPQRSTUVWXYZ