Metis EM Simulation tool meets unique signal and power integrity analysis challenges
Xpeedic has recently confirmed that Chipletz, a fabless substrate startup developing advanced packaging technology, has adopted its Metis electromagnetic (EM) simulation tool for Chipletz’s soon-to-be-released Smart Substrate products, which will allow for multiple ICs to be housed in a single package.
Bryan Black, CEO of Chipletz, has said that “the slowing of Moore’s Law and demand for compute performance is ushering in the era of advanced packaging and the increasing need for products like Xpeedic’s.” When it comes to runtime and memory usage, “Xpeedic and its Metis EM simulation tool are helping us meet our unique signal and power integrity analysis challenges.”
According to Feng Ling, CEO of Xpeedic, “The Chipletz Smart Substrate products will be a welcome addition to the toolkits of designers working on advanced 2.5D and 3D IC packaging.” “Particularly relevant to the artificial intelligence (AI) workload, immersive consumer experience, and high-performance computing markets, Smart Substrate will enable multiple ICs from different vendors in a single package. We are proud to play a part in the dissemination of this cutting-edge method of product protection.”
Metis, developed by Xpeedic, is an efficient EM simulation tool for high-level package simulation that can be used in tandem with IC and package design tools to meet capacity, accuracy, and throughput needs. Its cutting-edge 3-D EM solver technology provides record-breaking speed without sacrificing precision. From direct current (DC) to high frequencies (HF), all simulation needs are met by a single solver. Furthermore, it allows for multi-scale problems to be solved, allowing for integrated EM simulations of the die, interposer, and package in order to create cutting-edge packaging solutions.
