Embedded - System On Chip (SoC) Products For Sale - PDF - Integrated Circuits (ICs) -Page34

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Image	Part #	Manufacturer	Description	Pricing	Quantity	RoHS	Factory Lead Time	Lifecycle Status	Mount	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Architecture	Number of Inputs	Organization	Programmable Logic Type	Core Architecture	Max Frequency	Number of Logic Blocks (LABs)	Speed Grade	Primary Attributes	Number of Registers	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status

Image	Part #	Manufacturer	Description	Quantity	Factory Lead Time	Lifecycle Status	Mount	Package / Case	Surface Mount	Number of Pins	Supplier Device Package	Number of I/Os	Operating Temperature	Packaging	Published	Series	JESD-609 Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	ECCN Code	Terminal Finish	Max Operating Temperature	Min Operating Temperature	Additional Feature	HTS Code	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Supply Voltage	Terminal Pitch	Reach Compliance Code	Frequency	Time@Peak Reflow Temperature-Max (s)	Base Part Number	JESD-30 Code	Number of Outputs	Qualification Status	Operating Supply Voltage	Supply Voltage-Max (Vsup)	Power Supplies	Supply Voltage-Min (Vsup)	Interface	Max Supply Voltage	Min Supply Voltage	Speed	RAM Size	Core Processor	Peripherals	Connectivity	Architecture	Number of Inputs	Organization	Programmable Logic Type	Core Architecture	Max Frequency	Number of Logic Blocks (LABs)	Speed Grade	Primary Attributes	Number of Registers	Number of Logic Cells	Number of Equivalent Gates	Flash Size	Height Seated (Max)	Length	Width	Radiation Hardening	RoHS Status
	Mfr. Part # M2S005S-FG484I Elecinsight Part # 523-492-M2S005S-FG484I	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Datasheet Compare	Min.:1 Mult.:1	12 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	-	484-BGA	YES	-	-	209	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e0	Active	3 (168 Hours)	484	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B484	209	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	209	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 5K Logic Modules	-	6060	-	128KB	2.44mm	23mm	23mm	-	Non-RoHS Compliant
M2S005S-FG484I 523-492-M2S005S-FG484I Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S050-FCSG325I Elecinsight Part # 523-492-M2S050-FCSG325I	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Datasheet Compare	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 2 weeks ago)	-	325-TFBGA, CSPBGA	YES	-	-	200	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	325	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	200	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	200	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 50K Logic Modules	-	56340	-	256KB	1.01mm	11mm	11mm	-	RoHS Compliant
M2S050-FCSG325I 523-492-M2S050-FCSG325I Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S010TS-1VFG400 Elecinsight Part # 523-492-M2S010TS-1VFG400	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 400VFBGA Datasheet Compare	Min.:1 Mult.:1	10 Weeks	-	-	400-LFBGA	-	-	400-VFBGA (17x17)	195	0°C~85°C TJ	Tray	2015	SmartFusion®2	-	Active	3 (168 Hours)	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	-	-	-	-	FPGA - 10K Logic Modules	-	-	-	256KB	-	-	-	-	RoHS Compliant
M2S010TS-1VFG400 523-492-M2S010TS-1VFG400 Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # A2F200M3F-1PQG208I Elecinsight Part # 523-492-A2F200M3F-1PQG208I	Microsemi Corporation	IC FPGA 200K GATES 256KB 208QFP Datasheet Compare	Min.:1 Mult.:1	12 Weeks	-	-	208-BFQFP	-	208	208-PQFP (28x28)	MCU - 22, FPGA - 66	-40°C~100°C TJ	Tray	2015	SmartFusion®	-	Active	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	100MHz	-	A2F200	-	-	-	-	-	-	-	EBI/EMI, Ethernet, I2C, SPI, UART, USART	-	-	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	100MHz	8	-	ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops	-	-	-	256KB	-	-	-	-	RoHS Compliant
A2F200M3F-1PQG208I 523-492-A2F200M3F-1PQG208I Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S010TS-VF256 Elecinsight Part # 523-492-M2S010TS-VF256	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 256FBGA Datasheet Compare	Min.:1 Mult.:1	10 Weeks	-	-	256-LFBGA	YES	-	-	138	0°C~85°C TJ	Tray	-	SmartFusion®2	e0	Active	3 (168 Hours)	256	-	Tin/Lead (Sn/Pb)	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.8mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B256	138	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	138	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 10K Logic Modules	-	12084	-	256KB	1.56mm	14mm	14mm	-	Non-RoHS Compliant
M2S010TS-VF256 523-492-M2S010TS-VF256 Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S025-1FCSG325I Elecinsight Part # 523-492-M2S025-1FCSG325I	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Datasheet Compare	Min.:1 Mult.:1	10 Weeks	-	-	325-TFBGA, CSPBGA	YES	-	-	180	-40°C~100°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	325	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 25K Logic Modules	-	27696	-	256KB	1.01mm	11mm	11mm	-	RoHS Compliant
M2S025-1FCSG325I 523-492-M2S025-1FCSG325I Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S010TS-1FGG484I Elecinsight Part # 523-492-M2S010TS-1FGG484I	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 484FBGA Datasheet Compare	Min.:1 Mult.:1	10 Weeks	IN PRODUCTION (Last Updated: 1 month ago)	-	484-BGA	-	-	484-FPBGA (23x23)	233	-40°C~100°C TJ	Tray	2016	SmartFusion®2	-	Active	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	166MHz	-	M2S010TS	-	-	-	-	-	-	-	CAN, Ethernet, I2C, SPI, UART, USART, USB	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	-	-	-	ARM	-	-	-	FPGA - 10K Logic Modules	-	-	-	256KB	-	-	-	-	RoHS Compliant
M2S010TS-1FGG484I 523-492-M2S010TS-1FGG484I Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S025T-FCSG325 Elecinsight Part # 523-492-M2S025T-FCSG325	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 325BGA Datasheet Compare	Min.:1 Mult.:1	10 Weeks	-	-	325-TFBGA, CSPBGA	YES	-	-	180	0°C~85°C TJ	Tray	2015	SmartFusion®2	e3	Active	3 (168 Hours)	325	-	MATTE TIN	-	-	LG-MIN, WD-MIN	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	0.5mm	-	-	NOT SPECIFIED	-	S-PBGA-B325	180	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	180	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 25K Logic Modules	-	27696	-	256KB	1.01mm	11mm	11mm	-	RoHS Compliant
M2S025T-FCSG325 523-492-M2S025T-FCSG325 Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # A2F060M3E-TQ144 Elecinsight Part # 523-492-A2F060M3E-TQ144 IN STOCK: 832	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Datasheet Compare	Min.:1 Mult.:1	2 Weeks	-	-	144-LQFP	YES	-	-	MCU - 21, FPGA - 33	0°C~85°C TJ	Tray	2015	SmartFusion®	e0	Obsolete	3 (168 Hours)	144	-	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	QUAD	GULL WING	225	1.5V	0.5mm	-	80MHz	20	A2F060M3E	S-PQFP-G144	33	Not Qualified	-	1.575V	1.51.82.53.3V	1.425V	EBI/EMI, I2C, SPI, UART, USART	-	-	-	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	MCU, FPGA	33	1536 CLBS, 60000 GATES	FIELD PROGRAMMABLE GATE ARRAY	ARM	-	-	-	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	-	-	60000	128KB	1.6mm	20mm	20mm	-	Non-RoHS Compliant
A2F060M3E-TQ144 523-492-A2F060M3E-TQ144 Microsemi Corporation RoHS : Package : - In Stock : 832 1 : -
	Mfr. Part # A2F060M3E-TQG144 Elecinsight Part # 523-492-A2F060M3E-TQG144 IN STOCK: 831	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Datasheet Compare	Min.:1 Mult.:1	12 Weeks	-	-	144-LQFP	-	-	144-TQFP (20x20)	MCU - 21, FPGA - 33	0°C~85°C TJ	Tray	2000	SmartFusion®	-	Obsolete	3 (168 Hours)	-	-	-	85°C	0°C	-	-	-	-	-	-	-	-	80MHz	-	A2F060M3E	-	-	-	-	-	-	-	EBI/EMI, I2C, SPI, UART, USART	-	-	80MHz	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	-	-	-	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	-	-	-	128KB	-	-	-	-	RoHS Compliant
A2F060M3E-TQG144 523-492-A2F060M3E-TQG144 Microsemi Corporation RoHS : Package : - In Stock : 831 1 : -
	Mfr. Part # A2F060M3E-1FG256 Elecinsight Part # 523-492-A2F060M3E-1FG256	Microsemi Corporation	IC SOC CORTEX-M3 100MHZ 256FBGA Datasheet Compare	Min.:1 Mult.:1	-	-	-	256-LBGA	-	256	256-FPBGA (17x17)	MCU - 26, FPGA - 66	0°C~85°C TJ	Tray	2009	SmartFusion®	-	Obsolete	3 (168 Hours)	-	-	-	85°C	0°C	-	-	-	-	-	-	-	-	100MHz	-	A2F060M3E	-	-	-	1.5V	-	-	-	EBI/EMI, I2C, SPI, UART, USART	-	-	100MHz	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	100MHz	8	1	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	1536	-	-	128KB	-	-	-	No	Non-RoHS Compliant
A2F060M3E-1FG256 523-492-A2F060M3E-1FG256 Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # A2F060M3E-1TQ144I Elecinsight Part # 523-492-A2F060M3E-1TQ144I IN STOCK: 837	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Datasheet Compare	Min.:1 Mult.:1	-	-	-	144-LQFP	-	-	144-TQFP (20x20)	MCU - 21, FPGA - 33	-40°C~100°C TJ	Tray	2015	SmartFusion®	-	Obsolete	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	100MHz	-	A2F060M3E	-	-	-	-	-	-	-	EBI/EMI, I2C, SPI, UART, USART	-	-	100MHz	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	-	-	-	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	-	-	-	128KB	-	-	-	-	Non-RoHS Compliant
A2F060M3E-1TQ144I 523-492-A2F060M3E-1TQ144I Microsemi Corporation RoHS : Package : - In Stock : 837 1 : -
	Mfr. Part # A2F060M3E-FG256 Elecinsight Part # 523-492-A2F060M3E-FG256	Microsemi Corporation	IC FPGA 60K GATES 128KB 256FBGA Datasheet Compare	Min.:1 Mult.:1	2 Weeks	-	Surface Mount	256-LBGA	-	256	256-FPBGA (17x17)	MCU - 26, FPGA - 66	0°C~85°C TJ	Tray	2015	SmartFusion®	-	Obsolete	3 (168 Hours)	-	-	-	85°C	0°C	-	-	-	-	-	-	-	-	80MHz	-	A2F060M3E	-	-	-	1.5V	-	-	-	EBI/EMI, I2C, SPI, UART, USART	1.575V	1.425V	80MHz	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	100MHz	8	-	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	-	-	-	128KB	-	-	-	-	Non-RoHS Compliant
A2F060M3E-FG256 523-492-A2F060M3E-FG256 Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # A2F060M3E-TQ144I Elecinsight Part # 523-492-A2F060M3E-TQ144I IN STOCK: 836	Microsemi Corporation	IC FPGA 60K GATES 128KB 144-TQFP Datasheet Compare	Min.:1 Mult.:1	12 Weeks	-	-	144-LQFP	-	-	144-TQFP (20x20)	MCU - 21, FPGA - 33	-40°C~100°C TJ	Tray	2015	SmartFusion®	-	Obsolete	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	80MHz	-	A2F060M3E	-	-	-	-	-	-	-	EBI/EMI, I2C, SPI, UART, USART	-	-	80MHz	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	-	-	-	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	-	-	-	128KB	-	-	-	-	Non-RoHS Compliant
A2F060M3E-TQ144I 523-492-A2F060M3E-TQ144I Microsemi Corporation RoHS : Package : - In Stock : 836 1 : -
	Mfr. Part # A2F500M3G-1CSG288I Elecinsight Part # 523-492-A2F500M3G-1CSG288I	Microsemi Corporation	IC FPGA 500K GATES 512KB 288-CSP Datasheet Compare	Min.:1 Mult.:1	10 Weeks	-	-	288-TFBGA, CSPBGA	YES	-	-	MCU - 31, FPGA - 78	-40°C~100°C TJ	Tray	2013	SmartFusion®	e1	Active	3 (168 Hours)	288	-	Tin/Silver/Copper (Sn/Ag/Cu)	-	-	-	8542.39.00.01	BOTTOM	BALL	260	1.5V	0.5mm	-	100MHz	30	A2F500M3G	S-PBGA-B288	78	Not Qualified	1.5V	-	1.51.82.53.3V	-	EBI/EMI, Ethernet, I2C, SPI, UART, USART	1.575V	1.425V	-	64KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, Ethernet, I2C, SPI, UART/USART	MCU, FPGA	78	11520 CLBS, 500000 GATES	FIELD PROGRAMMABLE GATE ARRAY	ARM	-	-	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	500000	512KB	1.05mm	11mm	11mm	-	RoHS Compliant
A2F500M3G-1CSG288I 523-492-A2F500M3G-1CSG288I Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # A2F060M3E-1FG256M Elecinsight Part # 523-492-A2F060M3E-1FG256M	Microsemi Corporation	IC SOC CORTEX-M3 100MHZ 256FBGA Datasheet Compare	Min.:1 Mult.:1	-	-	-	256-LBGA	-	256	-	MCU - 26, FPGA - 66	-55°C~125°C TJ	Tray	-	SmartFusion®	-	Obsolete	3 (168 Hours)	-	-	-	-	-	-	8542.39.00.01	-	-	-	-	-	unknown	100MHz	-	A2F060M3E	-	-	-	-	-	-	-	EBI/EMI, I2C, SPI, UART, USART	-	-	-	16KB	ARM® Cortex®-M3	DMA, POR, WDT	EBI/EMI, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	-	-	-	ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops	-	-	-	128KB	-	-	-	-	Non-RoHS Compliant
A2F060M3E-1FG256M 523-492-A2F060M3E-1FG256M Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S150TS-1FC1152M Elecinsight Part # 523-492-M2S150TS-1FC1152M	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 1152BGA Datasheet Compare	Min.:1 Mult.:1	-	IN PRODUCTION (Last Updated: 1 month ago)	-	1152-BBGA, FCBGA	YES	-	-	574	-55°C~125°C TJ	Tray	2016	SmartFusion®2	e0	Active	3 (168 Hours)	-	3A001.A.2.C	Tin/Lead (Sn/Pb)	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	not_compliant	-	NOT SPECIFIED	-	S-PBGA-B1152	574	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	574	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	-	146124	-	512KB	2.9mm	35mm	35mm	-	Non-RoHS Compliant
M2S150TS-1FC1152M 523-492-M2S150TS-1FC1152M Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # M2S150T-1FCG1152M Elecinsight Part # 523-492-M2S150T-1FCG1152M	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 1152BGA Datasheet Compare	Min.:1 Mult.:1	-	IN PRODUCTION (Last Updated: 3 weeks ago)	-	1152-BBGA, FCBGA	YES	-	-	574	-55°C~125°C TJ	Tray	-	SmartFusion®2	e3	Active	3 (168 Hours)	-	3A001.A.2.C	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	-	-	NOT SPECIFIED	-	S-PBGA-B1152	574	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	574	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	-	146124	-	512KB	2.9mm	35mm	35mm	-	RoHS Compliant
M2S150T-1FCG1152M 523-492-M2S150T-1FCG1152M Microsemi Corporation RoHS : Package : - In Stock : - 1 : -
	Mfr. Part # A2F500M3G-1PQ208I Elecinsight Part # 523-492-A2F500M3G-1PQ208I IN STOCK: 10	Microsemi Corporation	IC FPGA 500K GATES 512KB 208QFP Datasheet Compare	Min.:1 Mult.:1	10 Weeks	-	Surface Mount	208-BFQFP	-	208	208-PQFP (28x28)	MCU - 22, FPGA - 66	-40°C~100°C TJ	Tray	2015	SmartFusion®	-	Obsolete	3 (168 Hours)	-	-	-	100°C	-40°C	-	-	-	-	-	-	-	-	100MHz	-	A2F500M3G	-	-	-	1.5V	-	-	-	Ethernet, I2C, SPI, UART, USART	1.575V	1.425V	100MHz	64KB	ARM® Cortex®-M3	DMA, POR, WDT	Ethernet, I2C, SPI, UART/USART	MCU, FPGA	-	-	-	ARM	100MHz	24	-	ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops	-	-	-	512KB	-	-	-	-	Non-RoHS Compliant
A2F500M3G-1PQ208I 523-492-A2F500M3G-1PQ208I Microsemi Corporation RoHS : Package : - In Stock : 10 1 : -
	Mfr. Part # M2S150TS-1FCG1152M Elecinsight Part # 523-492-M2S150TS-1FCG1152M	Microsemi Corporation	IC SOC CORTEX-M3 166MHZ 1152BGA Datasheet Compare	Min.:1 Mult.:1	-	IN PRODUCTION (Last Updated: 1 month ago)	-	1152-BBGA, FCBGA	YES	-	-	574	-55°C~125°C TJ	Tray	-	SmartFusion®2	e3	Active	3 (168 Hours)	-	3A001.A.2.C	MATTE TIN	-	-	-	8542.39.00.01	BOTTOM	BALL	NOT SPECIFIED	1.2V	1mm	-	-	NOT SPECIFIED	-	S-PBGA-B1152	574	Not Qualified	-	1.26V	1.2V	1.14V	-	-	-	166MHz	64KB	ARM® Cortex®-M3	DDR, PCIe, SERDES	CANbus, Ethernet, I2C, SPI, UART/USART, USB	MCU, FPGA	574	-	FIELD PROGRAMMABLE GATE ARRAY	-	-	-	-	FPGA - 150K Logic Modules	-	146124	-	512KB	2.9mm	35mm	35mm	-	RoHS Compliant
M2S150TS-1FCG1152M 523-492-M2S150TS-1FCG1152M Microsemi Corporation RoHS : Package : - In Stock : - 1 : -

Integrated Circuits (ICs)

Embedded - System On Chip (SoC) definition: A System On Chip (SoC) combines the required electronic circuits of various computer components onto a single, integrated chip (IC). SoC is ... Embedded - System On Chip (SoC) Product Listing: M2S005S-FG484I,M2S050-FCSG325I,M2S010TS-1VFG400,A2F200M3F-1PQG208I,M2S010TS-VF256.Integrated Circuits (ICs) type:Embedded - Microcontrollers(134273),Memory(116337),PMIC - Voltage Regulators - Linear(107072),PMIC - Supervisors(101983),Embedded - FPGAs (Field Programmable Gate Array)(62862) .Embedded - System On Chip (SoC) has 760 pieces of spot stock price information, you can click the "RFQ" button to confirm the inventory and price with the Elecinsight.

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